Call for Papers WiP Session

The Special Session to present Work in Progress (WiP) during Euromicro Conference on Digital System Design (DSD) and Software Engineering and Advanced Applications (SEAA) will be held at Sorbonne University, Paris, France, from 28th to 30th of August 2024.

Download the 2024 WiP Session CfP (PDF format) »


A Special Session related to DSD’2024 and SEAA’2024 is organized to present WORK in PROGRESS (WiP) in areas related the DSD and SEAA Conferences that is mainly aimed at the research and/or development projects (including Ph.D. and advanced M.Sc. projects) that have not yet attained their final or complete results.

Topics of Interest

Topics of Interest include (but are not limited to) the topics covered by the DSD’2024 and SEAA’2024 Conferences that are listed in the Calls for Papers of the DSD’2024 and SEAA’2024 Conferences and their Special Sessions and can be found at: and

Track/Session Committee

  • Radovan Stojanovic, University of Montenegro,
  • Budimir Lutovac, University of Montenegro,
  • Erwin Grosspietsch, Euromicro,
  • Dejan Karadglić, University of Montenegro,
  • Jovan Đurković, MECOnet,
  • Lech Jozwiak, TUE, Netherlands
  • Genci Capi, Hosei University, Japan
  • Goragod Pongthanisorn, Hosei University, Japan
  • Tomasz Kryjak, AGH University of Science and Technology, Poland
  • Sousuke Amasaki, Okayama Prefectural University, Japan
  • Zoya Dyka, IHP – Leibniz-Institut für innovative Mikroelektronik, Germany
  • Dmytro Petryk, IHP – Leibniz-Institut für innovative Mikroelektronik, Germany


Submission of Papers: authors intending to participate in the session should submit a short paper (maximum 4 pages) in DOCX (submission template) via submission form no later than by 14 July, 2024.

Accepted submissions will be published in a separate “Work in Progress” Proceedings and WiPiEC Journal,  and are to be presented in the session by short presentations of 10 minutes.

Important Dates

Submission Deadline: 14 July, 2024
Acceptance Notification: 19 July, 2024
Submission Deadline of Camera-Ready Paper: 31 July, 2024
Registration: (after 19 July 2024)

Paper layout according to standard IEEE layout rulesPaper template for WiP

Further details will be supplied together with the acceptance notification.

Registration fees

Main Conference Venue

The conference will take place at Sorbonne Université – Campus Pierre et Marie Curie located in the heart of Paris, the Latin Quarter (4 place Jussieu 75005 Paris).

The nearest metro station is Jussieu (lines 7 and 10).

The campus is easily accessible by taxi or public transport:

For more information visit the page: Venue and travel – 50th Anniversary (

WiP Registration process

  • All submissions are subject to double blind peer review as well as to plagiarism check.
  • For students, registration fees include Conference fees include admission to all technical sessions, welcome reception, lunch and two coffee breaks per day: access to conference proceedings on the internet.
  • Registration fee includes the preparation and publication of submitted work and research for Accepted submissions in published and separate “Work in Progress” Proceedings and WiPiEC Journal,
  • WiP Session Registration instructions

DSD/SEAA 2023 Works in Progress Proceedings – Journal Edition

DSD/SEAA 2023 Works in Progress Proceedings – Journal Edition PDF