28th Euromicro Conference Series on Digital System Design (DSD) 2025 will be held at Grant Hotel, Salerno, Italy, from 10th to 12th of September 2025.

 

Call for Papers

The Euromicro Conference on Digital System Design (DSD) addresses all aspects of (embedded, pervasive and high-performance) digital and mixed HW/SW system development and covers the entire design process from specification to microarchitectures, digital circuits and VLSI implementations. It is a forum for researchers and engineers from academia and industry working on advanced research, development and applications. It focuses on the current and future challenges of: advanced embedded, high-performance and cyber-physical applications; system and processor architectures for embedded and high performance HW/SW systems; design methodology and design automation for all design levels of embedded, high performance and cyber-physical systems; modern implementation technologies ranging from full-custom circuits in nanometer technology nodes to FPGAs and MPSoC infrastructures. Authors are cordially invited to submit their work on (but not limited to) the topics of the main track of the conference. In addition, contributions to various special sessions (with dedicated coordinators and sub-program committees) on specific topics of special interest are welcome. All papers will be reviewed according to common guidelines, quality requirements and acceptance thresholds.

Main Topics

  • Artificial intelligence from edge to cloud: architectures, methods, tools and applications
  • Design and synthesis of systems, hardware and embedded software – specification, modelling, analysis, validation and testing
  • Design automation at system, processor, register-transfer, logic and physical levels
  • Formal methods in system and hardware design
  • IoT, cyber-physical, embedded systems and applications
  • Systems-on-a-chip, networks-on-a-chip and systems-in-a-package
  • High-performance, energy-efficient multi-core and many-core (heterogeneous) processor architectures.
  • Autonomous/adaptable/reconfigurable systems and architectures
  • Security, safety, reliability and multi-objective optimization of embedded and cyber-physical systems
  • Future trends, new applications and new technologies

Special sessions

Important dates

  • Deadline for full paper submission:  15th April 2025
  • Notification of acceptance: 15th May 2025
  • Camera ready papers: 15th June 2025

Submissions will be open since 16th February,2025 and will close on 12th September 2025 (including possible on site registration). Registration information and fees will be available as soon the registration opens.

Submission guidelines

  • Authors are required to submit their manuscripts via the EasyChair web service at the web page https://easychair.org/conferences/?conf=dsd2025. Should an unexpected web access problem be encountered, please contact the Program Chairs Daniel Casini and Francisco J. Cazorla.
  • Each manuscript should include the complete paper text, all illustrations, and references. The manuscript should conform to the IEEE format: single-spaced, double-column, US letter page size, 10-point size Times Roman font, up to 8 pages. In order to conduct a double-blind review, no indication of the authors’ names should appear in the manuscript, references included. However, but authors should not hide previous work, instead, they need to make self-references in the third person.
  • All papers will be reviewed according to common guidelines, quality requirements, and acceptance thresholds. Program Chairs reserve the possibility to transfer papers between the main track and the special sessions so that each paper is reviewed in the track in which it fits best.
  • Accepted papers will be submitted for inclusion into IEEE Xplore Digital library and indexing services.

No-Show Policy

Please take note that the conference has a strict policy on no-show. Therefore, if your paper is accepted, one of the authors and their representatives MUST PRESENT their paper at the conference. Papers with no-show participants without a valid reason will not be submitted to IEEE Xplore. No refund of the paid fees may be claimed by the no-show author.

Journal Publication

Authors of the selected best papers will be invited to submit extended versions of their research to the ISI indexed Euromicro/Elsevier journal ”Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) which has a 2024 Impact Factor of 1.9 and Cite Score of 6.9.

Indexing

The proceedings of the DSD conference will be submitted to the following databases:

Program

Will be announced later.

Registration

Submissions will be open since 16th February,2025 and will close on 12th September 2025 (including possible on site registration). Registration information and fees will be available as soon the registration opens.

Venue and travel

Grand Hotel, Salerno, Italy, Lungomare Clemente Tafuri, 1, 84127 Salerno SA, Italia.

Venue contact is Gemma Catolino (email: gcatolino@unisa.it, tel: +39 089 963381).

Committees

DSD Steering Committee:

  • Lech Jóźwiak (Eindhoven University of Technology, NL) – Chairman
  • Paris Kitsos (University of Peloponnese, GR)
  • Tomasz Kryjak (AGH University of Krakow, PL)
  • Hana Kubatova (Czech Technical University in Prague, CZ)
  • Francesco Leporati (University of Pavia, IT)
  • José Silva Matos (University of Porto, PT)
  • Smail Niar (Polytechnic University of Hauts de-France, FR)
  • António Nuñez (University of Las Palmas de Gran Canaria, ES)
  • Eugenio Villar (University of Cantabria, ES)

DSD 2025 General Chairs:

  • Gemma Catolino, University of Salerno, IT
  • Carmine Gravino, University of Salerno, IT

DSD 2025 Program Chairs:

DSD 2025 Publicity Chair:

  • João Canas Ferreira (Univeristy of Porto, PT)

DSD 2025 Finance Co-Chairs:

  • Francesco Leporati (University of Pavia, IT)
  • Karl-Erwin Grosspietsch (Euromicro, DE)

DSD 2025 Technical Program Committee:

  • Irune Agirre, IKR, Spain
  • Liliana Andrade, Universite Grenoble Alpes, France
  • Matteo Andreozzi, Arm, UK
  • Federico Aromolo, Scuola Superiore Sant’Anna, Italy
  • Mohammad Ashjaei, Mälardalen University, Sweden
  • Antonio Carlos Schneider Beck, Federal University of Rio Grande do Sul, Brazil
  • Matthias Becker, KTH Royal Institute, Sweden
  • Mohamed Benazouz, CEA LIST DILS LISE, France
  • Jalil Boukhobza, ENSTA-Bretagne, France
  • Jani Boutellier, University of Vaasa, Finland
  • Halima Bouzidi, Polytechnic University of Hauts de France, France
  • Ramon Canal, UPC, Spain
  • Alessandro Capotondi, University of Modena and Reggio Emilia, Italy
  • Pedro P. Carballo, University of Las Palmas de Gran Canaria, Spain
  • Daniel Casini, School of Advanced Studies Sant’Anna, Italy
  • Roberto Cavicchioli, University of Modena and Reggio Emilia, Italy
  • Marcello Cinque, University of Naples Federico II, Italy
  • Giovanni Danese, University of Pavia, Italy
  • Karol Desnos, INSA Rennes, France
  • Tiago Dias, Instituto Superior de Engenharia de Lisboa, Portugal
  • Rolf Drechsler, University of Bremen, Germany
  • João Canas Ferreira, University of Porto, Portugal
  • Miguel Figueroa, University of Concepción, Chile
  • Petr Fišer, Czech Technical University in Prague, Czech Republic
  • Miguel Guitierrez Gaitan, Pontificia Universidad Católica de Chile, Chile
  • Francisco Garcia-Herrero, Universidad Complutense de Madrid, Spain
  • Ghayoor Gillani, University of Twente, The Netherlands
  • Roberto Giorgi, University of Siena, Italy
  • Giovani Gracioli, Federal University of Santa Catarina, Brazil
  • Carles Hernandez, Universitat Politècnica de València, Spain
  • Roel Jordans, Eindhoven University of Technology, The Netherlands
  • Lech Jozwiak, Eindhoven University of Technology, The Netherlands
  • Paris Kitsos, University of Peloponnese, Greece
  • Marek Kraft, Poznań University of Technology, Poland
  • Oliver Keszocze, University of Erlangen–Nuremberg, Germany
  • Tomasz Kryjak, AGH University of Krakow, Poland
  • Hana Kubatova, Czech Technical University in Prague, Czech Republic
  • Alexey Lastovetsky, University College Dublin, Ireland
  • Francesco Leporati, University of Pavia, Italy
  • Alberto Marchisio, New York University, USA
  • Maurizio Martina, Polytechnic University of Turin, Italy
  • Jose Matos, University of Porto, Portugal
  • Enrico Mezzetti, BSC, Spain
  • Antonio Miele, Polytechnic University of Milan, Italy
  • Sergey Mosin, Kazan Federal University, Russian Federation
  • Vojtech Mrazek, Brno University of Technology, Czech Republic
  • Pietro Nannipieri, University of Pisa, Italy
  • Nadia Nedjah, State University of Rio de Janeiro, Brazil
  • Smail Niar, Polytechnic University of Hauts de-France, France
  • Stefan Nikolić, University of Novi Sad, Serbia
  • António Nuñez, University of Las Palmas de Gran Canaria, Spain
  • Roman Obermaiser, University of Siegen, Germany
  • Arnaldo Oliveira, University of Aveiro, Portugal
  • Alex Orailoglu, University of California San Diego, USA
  • Theofanis Orphanoudakis, Hellenic Open University, Greece
  • Andres Otero, UPM, Spain
  • Ozcan Ozturk, Bilkent University, Turkey
  • Hiren Patel, U. Waterloo, Canada
  • Frédéric Pétrot, Grenoble Alpes University, France
  • Christian Pilato, Polytechnic University of Milan, Italy
  • Thilo Pionteck, Otto von Guericke University Magdeburg, Germany
  • Davide Quaglia, University of Verona, Italy
  • Alfonso Rodriguez, Technical University of Madrid, Spain
  • Sepideh Safari, Institute for Research in Fundamental Sciences (IPM), Iran
  • Mazen Saghir, American University of Beirut, Lebanon
  • Tobias Scheipel, Graz University of Technology, Austria
  • Jan Schmidt, Czech Technical University in Prague, Czech Republic
  • Olivier Sentieys, University of Rennes, France
  • Kostas Siozios, Aristotle University of Thessaloniki, Greece
  • Magnus Själander, University of Science and Technology, Norway
  • Nicolas Sklavos, University of Patras, Greece
  • Leonel Sousa, University of Lisbon, Portugal
  • Filippo Spiga, NVIDIA, UK
  • Radovan Stojanovic, University of Montenegro, Montenegro
  • Emanuele Torti, University of Pavia, Italy
  • Eugenio Villar, University of Cantabria, Spain
  • Chao Wang, University of Science and Technology of China, China
  • Heechul Yun, University of Kansas, USA
  • Arda Yurdakul, Boğaziçi University, Turkey
  • Houssam-Eddine Zahaf, University of Nantes, France
  • Andrej Zemva, University of Ljubljana, Slovenia
  • invitations are still in progress – last updated 07/01/2025

Feel free to contact us regarding any information or queries.